Full-iṣẹ PCB Apejọ Solutions PCBA ọkọ fun Industrial Electronics
Alaye iṣelọpọ
| Awoṣe No. | PCB-A43 |
| Apejọ ọna | SMT |
| Apoti gbigbe | Anti-aimi Packaging |
| Ijẹrisi | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Awọn itumọ | IPC Class2 |
| O kere aaye / Laini | 0.075mm / 3 milionu |
| Ohun elo | Ibaraẹnisọrọ |
| Ipilẹṣẹ | Ṣe lati orilẹ-ede Ṣaina |
| Agbara iṣelọpọ | 720.000 M2 / Odun |
ọja Apejuwe
PCBA Projects Ifihan
Ile-iṣẹ ABIS CIRCUITS ṣe awọn iṣẹ ifijiṣẹ, kii ṣe awọn ọja nikan.A nfun awọn solusan, kii ṣe awọn ọja nikan.
Lati iṣelọpọ PCB, awọn ohun elo rira si awọn paati papọ.Pẹlu:
PCB Aṣa
Iyaworan PCB / apẹrẹ ni ibamu si aworan atọka rẹ
PCB iṣelọpọ
Ipilẹṣẹ paati
PCB Apejọ
PCBA 100% igbeyewo
PCBA Awọn agbara
| 1 | Apejọ SMT pẹlu apejọ BGA |
| 2 | Awọn eerun SMD ti o gba: 0204, BGA, QFP, QFN, TSOP |
| 3 | Giga paati: 0.2-25mm |
| 4 | Iṣakojọpọ min: 0204 |
| 5 | Min ijinna laarin BGA: 0.25-2.0mm |
| 6 | Min BGA iwọn: 0.1-0.63mm |
| 7 | Min QFP aaye: 0.35mm |
| 8 | Min ijọ iwọn: (X * Y): 50*30mm |
| 9 | Iwọn apejọ ti o pọju: (X * Y): 350*550mm |
| 10 | Gbe-ibi konge: ± 0.01mm |
| 11 | Ibi agbara: 0805, 0603, 0402 |
| 12 | Ga pin ka tẹ fit wa |
| 13 | SMT agbara fun ọjọ kan: 80.000 ojuami |
Agbara - SMT
| Awọn ila | 9(5 Yamaha,4KME) |
| Agbara | 52 million placements fun osu |
| Max Board Iwon | 457*356mm.(18"X14") |
| Iwọn paati Min | 0201-54 sq.mm (0.084 sq.inch), asopo gigun, CSP, BGA, QFP |
| Iyara | 0,15 iṣẹju-aaya / ërún, 0,7 iṣẹju-aaya / QFP |
Agbara - PTH
| Awọn ila | 2 |
| Max iwọn ọkọ | 400 mm |
| Iru | Igbi meji |
| Pbs ipo | Atilẹyin laini laisi asiwaju |
| Iwọn otutu ti o pọju | 399 iwọn C |
| Sokiri ṣiṣan | afikun |
| Ṣaaju-ooru | 3 |
Kini DIP
package inline-pin meji, Ntọka si awọn eerun iyika iṣọpọ ti a ṣajọpọ ni fọọmu ila-meji.Julọ kekere ati alabọde-won ese iyika lo yi package.
Laini DIP wa
5 DIP Ọwọ Soldering Line
ABIS ni Laini Tita Ọwọ 5 DIP lati pari awọn iṣẹ akanṣe dara julọ fun awọn alabara wa.
Ojuse Engineer ilana
Awọn ẹlẹrọ wa yoo ṣayẹwo awọn ipo lori laini iṣelọpọ ati fun esi ti iṣoro.
Iṣakoso didara
| Idanwo AOI | Awọn sọwedowo fun solder lẹẹChecks fun irinše isalẹ lati 0201 Sọwedowo fun sonu irinše, aiṣedeede, ti ko tọ awọn ẹya ara, polarity |
| Ayẹwo X-ray | X-Ray n pese ayewo ti o ga ti:BGAs/Micro BGAs/Awọn idii iwọn Chip/Awọn igbimọ igboro |
| Idanwo inu-Circuit | Idanwo inu-Circuit jẹ lilo ni apapọ pẹlu AOI idinku awọn abawọn iṣẹ ṣiṣe ti o fa nipasẹ awọn iṣoro paati. |
| Idanwo agbara-soke | To ti ni ilọsiwaju Išẹ TestFlash Device siseto Idanwo iṣẹ-ṣiṣe |
Iwe-ẹri
FAQ
Rara, a ko le gba awọn faili aworan wọle, ti o ko ba ni faili gerber, ṣe o le fi apẹẹrẹ ranṣẹ si wa lati daakọ rẹ.
PCB&PCBA Ilana daakọ:
Bẹẹni, awọn PCB le ṣe apejọ pẹlu ọwọ, ṣugbọn o jẹ ilana ti n gba akoko ati ilana aṣiṣe.Apejọ adaṣe ni lilo awọn ẹrọ gbigbe-ati-ibi jẹ ọna ti o fẹ julọ fun awọn PCB pupọ julọ.
PCB jẹ igbimọ pẹlu awọn orin idẹ ati awọn paadi ti o so awọn paati itanna pọ.PCBA n tọka si apejọ awọn paati sori PCB lati ṣẹda ẹrọ itanna ti n ṣiṣẹ.
Sagbalagba lẹẹ ti wa ni lo lati mu itanna irinše fun igba die ṣaaju ki o to ti wa ni somọ patapata PCB nigba ti reflow soldering ilana.
| Agbara iṣelọpọ ti awọn ọja tita-gbona | |
| Double Side / Multilayer PCB onifioroweoro | Aluminiomu PCB onifioroweoro |
| Agbara Imọ-ẹrọ | Agbara Imọ-ẹrọ |
| Awọn ohun elo aise: CEM-1, CEM-3, FR-4 (TG giga), Rogers, TELFON | Awọn ohun elo aise: ipilẹ aluminiomu, ipilẹ Ejò |
| Layer: 1 Layer to 20 Layer | Layer: 1 Layer ati 2 Layer |
| Ibú Min.ila/aaye: 3mil/3mil(0.075mm/0.075mm) | Ibú Min.ila/aaye: 4mil/4mil(0.1mm/0.1mm) |
| Min.Iho iwọn: 0.1mm (dirilling iho) | Min.Iwọn iho: 12mil (0.3mm) |
| O pọju.Iwọn igbimọ: 1200mm * 600mm | Iwọn ti o pọju: 1200mm* 560mm(47in* 22in) |
| Pari ọkọ sisanra: 0.2mm- 6.0mm | Pari ọkọ sisanra: 0.3 ~ 5mm |
| sisanra bankanje Ejò: 18um ~ 280um (0.5oz ~ 8oz) | sisanra bankanje Ejò: 35um ~ 210um (1oz ~ 6oz) |
| Ifarada Iho NPTH: +/- 0.075mm, Ifarada iho PTH: +/- 0.05mm | Ifarada ipo Iho: +/- 0.05mm |
| Ifarada Ifarada: +/- 0.13mm | Ifarada ilana ipa ọna: +/ 0.15mm;ifarada ìla punching: +/ 0.1mm |
| Ilẹ ti pari: HASL ti ko ni idari, goolu immersion(ENIG), fadaka immersion, OSP, fifi goolu, ika goolu, Carbon INK. | Ilẹ ti pari: HASL ọfẹ asiwaju, goolu immersion (ENIG), fadaka immersion, OSP ati bẹbẹ lọ |
| Ifarada iṣakoso ikọsẹ: +/- 10% | Wà sisanra ifarada: +/- 0.1mm |
| Agbara iṣelọpọ: 50,000 sqm / osù | MC PCB Production agbara: 10.000 sqm / osù |
Awọn ilana Imudaniloju Didara wa bi isalẹ:
a),Ayẹwo wiwo
b), Iwadii ti n fo, ohun elo imuduro
c), Iṣakoso impedance
d), Solder-agbara erin
e), Digital metallograghic maikirosikopu
f),AOI(Aifọwọyi Optical Ayewo)
Awọn alaye ti awọn ohun elo (BOM):
a),Mawọn nọmba awọn anufacturers,
b),CNọmba awọn ẹya awọn olupese ti awọn olutaja (fun apẹẹrẹ Digi-bọtini, Mouser, RS)
c), awọn fọto ayẹwo PCBA ti o ba ṣeeṣe.
d), Opoiye
ABIS ko ni awọn ibeere MOQ fun boya PCB tabi PCBA.
ABlS ṣe 100% wiwo ati ayewo AOl bii ṣiṣe idanwo itanna, idanwo foliteji giga, idanwo iṣakoso impedance, apakan micro, idanwo mọnamọna gbona, idanwo tita, idanwo igbẹkẹle, idanwo idabobo, ionic cleanliness igbeyewoati PCBA Iṣẹ-ṣiṣe igbeyewo.
Pẹlu ABIS, awọn alabara ni pataki ati ni imunadoko dinku awọn idiyele rira agbaye wọn.Lẹhin iṣẹ kọọkan ti a pese nipasẹ ABIS, ti wa ni pamọ fifipamọ iye owo fun awọn alabara.
.A ni awọn ile itaja meji papọ, ọkan jẹ fun apẹrẹ, titan iyara, ati ṣiṣe iwọn didun kekere.Omiiran jẹ fun iṣelọpọ ibi-pupọ tun fun igbimọ HDI, pẹlu awọn oṣiṣẹ alamọdaju ti o ni oye pupọ, fun awọn ọja ti o ni agbara giga pẹlu awọn idiyele ifigagbaga ati ifijiṣẹ akoko.
.A pese awọn tita alamọdaju pupọ, imọ-ẹrọ ati atilẹyin ohun elo, lori ipilẹ kariaye pẹlu awọn wakati 24 ti esi ẹdun.
