6 fẹlẹfẹlẹ Lile Gold PCB Board pẹlu 3.2mm sisanra ọkọ ati Counter rii Iho
Alaye ipilẹ
| Awoṣe No. | PCB-A37 |
| Apoti gbigbe | Iṣakojọpọ igbale |
| Ijẹrisi | UL,ISO9001&ISO14001,RoHS |
| Ohun elo | Awọn ẹrọ itanna onibara |
| O kere aaye / Laini | 0.075mm / 3 milionu |
| Agbara iṣelọpọ | 50,000 sqm / osù |
| HS koodu | 853400900 |
| Ipilẹṣẹ | Ṣe lati orilẹ-ede Ṣaina |
ọja Apejuwe
HDI PCB Ifihan
HDI PCB jẹ asọye bi igbimọ iyika ti a tẹjade pẹlu iwuwo onirin ti o ga julọ fun agbegbe ẹyọkan ju PCB ti aṣa lọ.Wọn ni awọn laini ti o dara pupọ ati awọn alafo, awọn vias kekere ati awọn paadi Yaworan, ati iwuwo paadi asopọ ti o ga julọ ju iṣẹ lọ ni imọ-ẹrọ PCB ti aṣa.Awọn PCB HDI ni a ṣe nipasẹ awọn microvias, ti a sin nipasẹs ati lamination lẹsẹsẹ pẹlu awọn ohun elo idabobo ati awọn onirin adaorin fun iwuwo giga ti ipa-ọna.
Awọn ohun elo
HDI PCB ti wa ni lilo lati din iwọn ati iwuwo, bi daradara bi lati mu itanna išẹ ti awọn ẹrọ.HDI PCB jẹ yiyan ti o dara julọ si kika Layer giga ati laminate boṣewa ti o gbowolori tabi awọn igbimọ laminated lẹsẹsẹ.HDI ṣafikun afọju ati sin nipasẹs ti o ṣe iranlọwọ lati ṣafipamọ ohun-ini gidi PCB nipa gbigba awọn ẹya ati awọn laini lati ṣe apẹrẹ loke tabi isalẹ wọn laisi ṣiṣe asopọ kan.Pupọ ti BGA ti o dara ti ode oni ati awọn ifẹsẹtẹ paati isipade-chip ko gba laaye fun ṣiṣe awọn itọpa laarin awọn paadi BGA.Afọju ati sin nipasẹs yoo so awọn fẹlẹfẹlẹ nikan ti o nilo awọn asopọ ni agbegbe naa.
Imọ-ẹrọ & Agbara
| Nkan | AGBARA | Nkan | AGBARA |
| Fẹlẹfẹlẹ | 1-20L | Ejò ti o nipon | 1-6OZ |
| Awọn ọja Iru | HF (Igbohunsafẹfẹ giga) & (Igbohunsafẹfẹ Redio) igbimọ, Igbimọ iṣakoso Imedance, HDIboard, BGA & Fine Pitch Board | Solder boju | Nanya & Taiyo;LRI & Matt Red.alawọ ewe,ofeefee,funfun,bulu,dudu |
| Ohun elo ipilẹ | FR4 (Shengyi China, ITEQ, KB A +, HZ), HITG, FrO6, Rogers, Taconic, Argon, Nalco lsola ati bẹbẹ lọ | Ipari Ilẹ | HASL ti aṣa, HASL ti ko ni aṣaaju, FlashGold, ENIG (lmmersion Gold) OSP (Entek), lmmersion TiN, fadaka lmmersion, Wura lile |
| Yiyan dada itọju | ENIG(Gold immersion) + OSP ,ENIG(Gold immersion) + Ika goolu, ika goolu filasi, immersionSlive + ika goolu, Tin Immersion + Ika goolu | ||
| Imọ Specification | Iwọn ila to kere julọ/aafo: 3.5/4mil (dril lesa) Iwọn iho ti o kere julọ: 0.15 mm (lilu ẹrọ / 4 ọlọ lesa lilu) Oruka Ọdun ti o kere julọ: 4mil Idiwọn Ejò ti o pọju: 6Oz Iwọn iṣelọpọ ti o pọju: 600x1200mm Sisanra Board: D/S: 0.2-70mm, Multilayers: 0.40-7.Omm Min Solder Boju Afara: ≥0.08mm Ipin abala: 15:1 Pluging vias agbara: 0.2-0.8mm | ||
| Ifarada | Ifarada awọn iho palara: ± 0.08mm(min± 0.05) Ifarada iho ti kii-palara: ± O.05min (min + O/-005mm tabi +0.05/Omm) Ifarada Lakaye: ± 0.15 min(min± 0.10mm) Idanwo iṣẹ-ṣiṣe: Atako ti o lagbara: 50 ohms (deede) Pe agbara kuro: 14N/mm Gbona Wahala igbeyewo: 265C.20 aaya Solder líle boju: 6H E-igbeyewo foliteji: 50ov± 15/-0V 3os Warp ati Twist: 0.7% ( igbimọ idanwo semikondokito 0.3%) | ||
Awọn ẹya ara ẹrọ-Afani Awọn ọja wa
Die e sii ju 15 ọdun ni iriri olupese ni aaye iṣẹ PCB
Iwọn nla ti iṣelọpọ n rii daju pe idiyele rira rẹ dinku.
Laini iṣelọpọ ilọsiwaju ṣe iṣeduro didara iduroṣinṣin ati gigun igbesi aye gigun
Idanwo 100% fun gbogbo awọn ọja PCB ti a ṣe adani
Iṣẹ-iduro kan, a le ṣe iranlọwọ lati ra awọn paati
Q / T Aago asiwaju
| Ẹka | Awọn ọna asiwaju Time | Deede asiwaju Time |
| Oni-meji | wakati 24 | wakati 120 |
| 4 fẹlẹfẹlẹ | wakati 48 | wakati 172 |
| 6 fẹlẹfẹlẹ | wakati 72 | wakati 192 |
| 8 fẹlẹfẹlẹ | wakati 96 | wakati 212 |
| 10 fẹlẹfẹlẹ | wakati 120 | wakati 268 |
| 12 fẹlẹfẹlẹ | wakati 120 | wakati 280 |
| 14 fẹlẹfẹlẹ | wakati 144 | wakati 292 |
| 16-20 fẹlẹfẹlẹ | Da lori awọn kan pato awọn ibeere | |
| Ju 20 Layer | Da lori awọn kan pato awọn ibeere | |
Gbigbe ABIS lati ṣakoso FR4 PCBS
Iho igbaradi
Yiyọ idoti ni pẹkipẹki & ṣatunṣe awọn paramita ẹrọ liluho: ṣaaju fifin nipasẹ pẹlu bàbà, ABIS san ifojusi giga si gbogbo awọn iho lori PCB FR4 ti a ṣe itọju lati yọ idoti, awọn aiṣedeede dada, ati smear iposii, awọn ihò mimọ rii daju pe fifin ni aṣeyọri faramọ awọn odi iho .tun, ni kutukutu awọn ilana, lu ẹrọ sile ti wa ni titunse parí.
Dada Igbaradi
Deburring fara: awọn oṣiṣẹ imọ-ẹrọ wa ti o ni iriri yoo mọ ṣaaju akoko pe ọna kan ṣoṣo lati yago fun abajade buburu ni lati nireti iwulo fun mimu pataki ati lati ṣe awọn igbesẹ ti o yẹ lati rii daju pe ilana naa ti ṣe ni pẹkipẹki ati ni deede.
Gbona Imugboroosi Awọn ošuwọn
Ni deede lati ṣe pẹlu awọn oriṣiriṣi awọn ohun elo, ABIS yoo ni anfani lati ṣe itupalẹ apapo lati rii daju pe o yẹ.lẹhinna titọju igbẹkẹle igba pipẹ ti CTE (alaisọdipúpọ ti imugboroosi igbona), pẹlu CTE kekere, o kere julọ ti o ṣeese ti palara nipasẹ awọn ihò lati kuna lati yiyi pada leralera ti bàbà eyiti o jẹ awọn asopọ asopọ Layer ti inu.
Iwọn iwọn
ABIS iṣakoso awọn circuitry ti wa ni ti iwọn-soke nipa mọ awọn ogorun ni ifojusona ti yi pipadanu ki awọn fẹlẹfẹlẹ yoo pada si wọn bi-apẹrẹ mefa lẹhin ti awọn lamination ọmọ ti pari.pẹlupẹlu, lilo awọn iṣeduro igbelosoke ipilẹ ti olupese laminate ni apapo pẹlu data iṣakoso ilana iṣiro inu ile, lati tẹ awọn ifosiwewe iwọn ti yoo wa ni ibamu ni akoko pupọ laarin agbegbe iṣelọpọ pato yẹn.
Ṣiṣe ẹrọ
Nigbati akoko ba de lati kọ PCB rẹ, ABIS rii daju pe o yan ni ohun elo to tọ ati iriri lati gbejade
Apinfunni Didara ABIS
Oṣuwọn kọja ti ohun elo ti nwọle loke 99.9%, nọmba awọn oṣuwọn ijusile pupọ ni isalẹ 0.01%.
Awọn ile-iṣẹ ifọwọsi ABIS ṣakoso gbogbo awọn ilana bọtini lati yọkuro gbogbo awọn ọran ti o pọju ṣaaju iṣelọpọ.
ABIS nlo sọfitiwia ilọsiwaju lati ṣe itupalẹ DFM lọpọlọpọ lori data ti nwọle, o si nlo awọn eto iṣakoso didara ilọsiwaju jakejado ilana iṣelọpọ.
ABIS ṣe 100% wiwo ati ayewo AOI bii ṣiṣe idanwo itanna, idanwo foliteji giga, idanwo iṣakoso impedance, apakan bulọọgi, idanwo mọnamọna gbona, idanwo tita, idanwo igbẹkẹle, idanwo idabobo ati idanwo mimọ ionic.
Iwe-ẹri
FAQ
Pupọ ninu wọn lati Shengyi Technology Co., Ltd. (SYTECH), ti o jẹ olupilẹṣẹ CCL keji ti agbaye ni awọn ofin ti iwọn tita, lati 2013 si 2017. A ṣe agbekalẹ awọn ibatan igba pipẹ ti ifowosowopo lati ọdun 2006. Awọn ohun elo resini FR4 (Awoṣe S1000-2, S1141, S1165, S1600) ti wa ni o kun lo fun ṣiṣe nikan ati ki o ni ilopo-apa tejede Circuit lọọgan bi daradara bi olona-Layer lọọgan.Eyi wa awọn alaye fun itọkasi rẹ.
Fun FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA
Fun CEM-1 & CEM 3: Sheng Yi, King Board
Fun Igbohunsafẹfẹ giga: Sheng Yi
Fun Itọju UV: Tamura, Chang Xing (* Awọ to wa: Alawọ ewe) Solder fun Apa Kanṣoṣo
Fun Fọto Liquid: Tao Yang, koju (Fiimu tutu)
Chuan Yu (* Awọn awọ to wa: Funfun, Yellow Solder Fojuinu, eleyi ti, Pupa, Buluu, Alawọ ewe, Dudu)
), 1 Wakati agbasọ
b), 2 wakati ti ẹdun esi
c), atilẹyin imọ-ẹrọ wakati 7 * 24
d), 7*24 iṣẹ ibere
e), ifijiṣẹ wakati 7 * 24
f), 7 * 24 ṣiṣe iṣelọpọ
Rara, a ko le gba awọn faili aworan, ti o ko ba ni faili Gerber, ṣe o le fi apẹẹrẹ ranṣẹ si wa lati daakọ rẹ.
Ilana ẹda PCB&PCBA:
Awọn ilana Imudaniloju Didara wa bi isalẹ:
a),Ayẹwo wiwo
b), Iwadii ti n fo, ohun elo imuduro
c), Iṣakoso ikọlu
d), Solder-agbara erin
e), Digital metallo graghic maikirosikopu
f), AOI (Ayẹwo Opitika Aifọwọyi)
Oṣuwọn ifijiṣẹ akoko jẹ diẹ sii ju 95%
a), 24 wakati yipada yara fun PCB afọwọkọ ẹgbẹ meji
b),48wakati fun 4-8 fẹlẹfẹlẹ PCB Afọwọkọ
c), 1 wakati fun agbasọ
d), Awọn wakati 2 fun ibeere ẹlẹrọ / esi ẹdun
e), Awọn wakati 7-24 fun atilẹyin imọ-ẹrọ / iṣẹ aṣẹ / awọn iṣẹ iṣelọpọ
ABIS ko ni awọn ibeere MOQ fun boya PCB tabi PCBA.
ABlS ṣe 100% wiwo ati ayewo AOl bii ṣiṣe idanwo itanna, idanwo foliteji giga, idanwo iṣakoso ikọlu, apakan micro, idanwo mọnamọna gbona, idanwo solder, idanwo igbẹkẹle, idanwo idabobo, idanwo mimọ ionic ati idanwo iṣẹ ṣiṣe PCBA.
Awọn ile-iṣẹ akọkọ ABIS: Iṣakoso ile-iṣẹ, Ibaraẹnisọrọ, Awọn ọja Ọkọ ayọkẹlẹ ati Iṣoogun.Ọja Akọkọ ABIS: 90% Ọja Kariaye (40% -50% fun AMẸRIKA, 35% fun Yuroopu, 5% fun Russia ati 5% -10% fun Ila-oorun Asia) ati 10% Ọja Abele.
| Agbara iṣelọpọ ti awọn ọja tita-gbona | |
| Double Side / Multilayer PCB onifioroweoro | Aluminiomu PCB onifioroweoro |
| Agbara Imọ-ẹrọ | Agbara Imọ-ẹrọ |
| Awọn ohun elo aise: CEM-1, CEM-3, FR-4 (TG giga), Rogers, TELFON | Awọn ohun elo aise: ipilẹ aluminiomu, ipilẹ Ejò |
| Layer: 1 Layer to 20 Layer | Layer: 1 Layer ati 2 Layer |
| Ibú Min.ila/aaye: 3mil/3mil(0.075mm/0.075mm) | Ibú Min.ila/aaye: 4mil/4mil(0.1mm/0.1mm) |
| Min.Iho iwọn: 0.1mm (dirilling iho) | Min.Iwọn iho: 12mil (0.3mm) |
| O pọju.Iwọn igbimọ: 1200mm * 600mm | Iwọn ti o pọju: 1200mm* 560mm(47in* 22in) |
| Pari ọkọ sisanra: 0.2mm- 6.0mm | Pari ọkọ sisanra: 0.3 ~ 5mm |
| sisanra bankanje Ejò: 18um ~ 280um (0.5oz ~ 8oz) | sisanra bankanje Ejò: 35um ~ 210um (1oz ~ 6oz) |
| Ifarada Iho NPTH: +/- 0.075mm, Ifarada iho PTH: +/- 0.05mm | Ifarada ipo Iho: +/- 0.05mm |
| Ifarada Ifarada: +/- 0.13mm | Ifarada ilana ipa ọna: +/ 0.15mm;ifarada ìla punching: +/ 0.1mm |
| Ilẹ ti pari: HASL ti ko ni idari, goolu immersion(ENIG), fadaka immersion, OSP, fifi goolu, ika goolu, Carbon INK. | Ilẹ ti pari: HASL ọfẹ asiwaju, goolu immersion (ENIG), fadaka immersion, OSP ati bẹbẹ lọ |
| Ifarada iṣakoso ikọsẹ: +/- 10% | Wà sisanra ifarada: +/- 0.1mm |
| Agbara iṣelọpọ: 50,000 sqm / osù | MC PCB Production agbara: 10.000 sqm / osù |
